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Al-Si Alloy Electronic Packaging

Power Electronic Components

 

Material: Al-Si Alloys

 

Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.

 

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  • Product Details

Product Description 

  • Semiconductor manufacturing equipment;
  • Electrical power system;
  • DC converter;
  • Other electronic components.

 

Selectable Silicon Aluminum(Si/Al) Alloys

  • AlSi50(Al-50%Si controlled expansion alloy);
  • AlSi70(Si-30%Al controlled expansion alloy).

 

Advantages

  • High thermal conductivity; 
  • Low density;
  • Excellent processability;
  • CTE match to circuit board and assembly components.

 

AlSi Alloys Performance Parameters

 

Content

wt%

  Density  

g/cm³

CTE 

25℃

ppm/℃

Thermal 

Conductivity

25℃ W/mK

Tensile 

Strength 

MPa

Yield 

Strength 

 

MPa

Poisson’s 

Ratio

Elongation

%

Elastic

Modulus

 GPa

Al-27%Si

2.6

17

175

170

130

0.29

3.8

91

Al-42%Si

2.55

13.5

143

200

187

0.29

1

105

Al-50%Si

2.5

11.5

140

200

210

0.28

<1

108

Si-40%Al

2.46

9

125

181

181

0.27

<1

121

Si-30%Al

2.43

7.5

120

138

138

0.25

<1

131

    Si-20%Al

2.40

6

110

125

125

--

--

132
Content

Density

g/cm³

  CTE   

 ppm/℃

     Thermal      Conductivity   W/mK Tensile  Strength MPa Yield  Strength  MPa

Poisson’s 

 Ratio

Elongation  %

Elastic Modulus   GPa 
BEW 6061 2.7 22.6 210 312 270 0.33 12.5 69
BEW 4047 2.66 21.6 193 208 129 0.33 18 70